Datacon apm 2200 manual

Datacon evo • High speed multi chip module assembly • SiP – stacked die / epoxy, spacer film and WBL (Wafer Backside Lamination) • Thin die handling (down to below 30 µm) • Reticle (multi-project) wafers • Fast product change due to recipe driven tool change • Highest performance in the high end market, up to 7, UPH. The new Datacon evo advanced is the latest edition in the well- established and field proven Multi Module Attach platform of www.doorway.ru an all new gantry controller system as well as a completely new vision and camera generation Datacon evo advanced offers superb 3μm placement accuracy while still focusing on your productivity and throughput requirements. Used DATACON / BESI APM (DIE ATTACHERS) for sale. Manufacturer: DATACON / BESI Model: APM Category: DIE ATTACHERS. CAE has broad access to semiconductor related equipment direct from fabs, often unavailable through other sources. CAE finds the best deals on used DATACON / BESI APM. CAE has 20 die attachers currently www.doorway.ru: DATACON / BESI.

DATACON / BESI APM+. NEWPORT MRSI DATACON CS DYNATEX DXB DYNATEX DXB NEWPORT MRSI NEWPORT MRSI DATACON PPS KS At Bridge Tronic Global, we have 'Datacon APM+ Pick and Place ' available for sale. Please contact us at sales@www.doorway.ru or + Datacon evo • High speed multi chip module assembly • SiP - stacked die / epoxy, spacer film and WBL (Wafer Backside Lamination) • Thin die handling (down to below 30 µm) • Reticle (multi-project) wafers • Fast product change due to recipe driven tool change • Highest performance in the high end market, up to 7, UPH.

Datacon evoplus Innovative Solution for Innovative Products Future Proof Equipment s The Datacon evoplus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership. Besides unbeaten flexibility and full. The new Datacon evo advanced is the latest edition in the well- established and field proven Multi Module Attach platform of www.doorway.ru an all new gantry controller system as well as a completely new vision and camera generation Datacon evo advanced offers superb 3μm placement accuracy while still focusing on your productivity and throughput requirements. The Datacon high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the Datacon is prepared for present and future processes and products.